Food Industry Internships
Internship Overview
Join our paid food industry internship program and gain hands-on experience solving real-world challenges in collaboration with food industry professionals.
Duration: 250-hour internship
Stipend: $4,000
Additional Support: Up to $2,000 available for travel expenses
Eligibility: MS Food Science students at SDSU (10 placements available)
Location: Various industry partner locations
Why Participate in a Food Industry Internship?
Participating in a food industry internship is a great opportunity to gain valuable insights into the food industry, build a professional network, and acquire the critical skills employers are looking for. Here are some of the benefits of the internship program:
- Practical Experience: Apply classroom knowledge to solve food industry problems.
- Skill Development: Enhance both technical skills (e.g., product development, quality assurance) and essential soft skills (e.g., teamwork, communication).
- Career Networking: Build professional connections with industry experts.
- Resume Boost: Gain standout experience that will set you apart in the competitive job market.
What You’ll Do
During the internship, you'll immerse yourself in a professional food industry setting, tackling real business challenges under the guidance of experienced mentors. Key activities include:
- Engaging in research and development to address industry needs
- Problem-solving with your team to optimize products and processes
- Learning industry-standard tools, technologies, and best practices
- Developing leadership, time management, and communication skills
- Contributing to meaningful projects that propel the food industry forward
Contact Information
Have questions? Want to learn more about this opportunity?
Contact: Dr. Changqi Liu
Email: [email protected]
Acknowledgement
This program is supported by the Higher Education Challenge Grants Program, project award no. 2024-70003-43594, from the U.S. Department of Agriculture’s National Institute of Food and Agriculture.
Contact Us
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